Data Centers: Low-Power Cryogenic Memory Technology and Advanced Cooling Solutions

As the digital age progresses, data centers are becoming the backbone of global information infrastructure. However, the exponential growth of data and the increasing reliance on AI-driven processes have led to a surge in power consumption. But technologies have emerged to address this critical issue. These innovations promise to significantly reduce power usage and improve efficiency, marking a new era for data center operations.

Data centers have become the backbone of our modern society. These critical facilities house vast amounts of data and run 24/7, providing essential services for businesses, governments, and individuals alike.

But they consume a lot of power. Some companies are trying to address this problem. We focused on two of them. SureCore developed a low-power cryogenic memory technology. Vertiv designed advanced cooling solutions for high-performance computing. These innovations promise substantial reductions in power consumption and enhance the overall efficiency and scalability of AI and high-performance computing infrastructures.

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SureCore’s Low Power Cryogenic Memory Technology

Sheffield-based SureCore has made significant strides in addressing the power consumption challenge in data centers. Their low-power cryogenic memory technology operates at extremely low temperatures, down to 4K, and is equally effective at 77K. This technology leverages advancements initially developed for quantum computing, enabling memory solutions that drastically reduce power dissipation.

The key advantage of SureCore’s technology lies in its ability to integrate with AI processors and server chips, which commonly utilize large amounts of SRAM. By migrating to SureCore’s low-power cryogenic memory, data centers can reduce both the thermal load and the associated cooling costs, potentially achieving a four-fold reduction in power usage.

In a press release, Paul Wells, SureCore’s CEO, highlighted the collaboration with Semiwise in developing cryogenic transistor SPICE models. He said:

“As part of an InnovateUK funded project, we have worked closely with our partner Semiwise who have developed cryogenic transistor SPICE models. These have enabled us to port and tune our low-power memory technology to work at temperatures down to 4K. The goal was not only to develop memory for cryogenic operation but also to exploit our power-saving techniques to minimize the thermal load in the cryostat. For a datacentre operating at 77K, similar challenges apply and, by saving up to 50% of the memory power, a significant cut in thermal dissipation is possible with knock-on effects for the cooling power budget.”

With the capability to operate from 77K down to near absolute zero, SureCore’s CryoMem range of IP is poised to revolutionize data center efficiency by minimizing thermal dissipation and cutting cooling power budgets.

For Professor Asen Asenov, CEO of SemiWise,

“The key to successfully enabling the AI revolution is the availability of access to accurate cryogenic transistor SPICE models. This will allow IP developers to create suites of IP so that SoC developers can create next-generation AI server chips. SemiWise has developed a unique technology to engineer PDK-strength cryogenic SPICE models based on a limited suite of cryogenic measurements supplemented by TCAD simulations.”

Vertiv’s Advanced Cooling Solutions for AI

In parallel with SureCore’s advancements, Vertiv has introduced the Vertiv™ 360AI, a comprehensive portfolio of high-density data center infrastructure solutions designed to meet the demanding power and cooling requirements of AI and high-performance computing (HPC). Launched across Europe, the Middle East, and Africa (EMEA), this new range simplifies the deployment of AI infrastructure at various scales, from small-scale pilots to full-fledged data centers.

Vertiv’s solutions address the unprecedented demand for power and cooling driven by AI, with rack densities expected to reach up to 500kW. The Vertiv™ 360AI portfolio includes prefabricated modular solutions and validated designs that streamline the power and cooling infrastructure deployment, eliminating complex design cycles and ensuring rapid scalability.

Karsten Winther, President of Vertiv EMEA, emphasized the importance of these solutions in accelerating AI deployment while maintaining efficiency. The Vertiv™ 360AI solutions are designed to retrofit existing air-cooled data centers and support the development of new, large-scale hyperscale projects without disrupting current operations.

As the digital landscape continues to evolve, such technological advancements are crucial in ensuring that data centers can sustainably support the growing demand for computational power.