HGTECH Laser cleaning equipment is relatively common in various industries at present, generally to remove rust stains or pollution layers. Common cleaning methods include sandblasting, abrasive cleaning and chemical cleaning. These cleaning methods have certain defects, such as serious pollution, large labor consumption, and damage to raw materials. Laser cleaning can effectively avoid these problems, and can truly achieve low pollution, labor-saving and harmless raw material cleaning.
The cleaning process of laser cleaning equipment relies on the light pulse generated by the laser, which is based on the photophysical reaction generated by the interaction of high-intensity beam, short-pulse laser and the pollution layer. Laser cleaning equipment plays an important role in many industries, such as automobile manufacturing, semiconductor wafer cleaning, precision parts processing and manufacturing, building exterior wall cleaning, cultural relics protection, circuit board cleaning, precision parts processing and manufacturing, LCD cleaning, smear removal, oil removal, paint removal, etc.
How does laser cleaning equipment remove paint? After understanding the cleaning process of the laser cleaning machine, you also need to understand the principle of paint. The paint applied to the metal surface is equivalent to a special layer of plasma, which protects the metal from corrosion and oxidation. Plasma is generated only when the energy density is above the threshold, depending on the removal of contamination or oxide layers.
Each laser pulse removes a certain thickness of the contamination layer. If the contamination layer is thick, multiple pulse cleaning is required. The number of pulses required to clean the surface depends on the degree of surface contamination. An important consequence of these two thresholds is self-control of cleaning. Light pulses with an energy density above the threshold will remove contaminants until the substrate arrives. However, since its energy density is lower than the failure threshold of the substrate material, the substrate is not damaged.